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Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring

Date

2016
Proceedings Paper
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dc.contributor.authorSuhard, Samuel
dc.contributor.authorIwasaki, Akihisa
dc.contributor.authorLiebens, Maarten
dc.contributor.authorStiers, Karen
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorHolsteyns, Frank
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorStiers, Karen
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorHolsteyns, Frank
dc.date.accessioned2021-10-23T15:19:36Z
dc.date.available2021-10-23T15:19:36Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27363
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7861453/
dc.source.beginpage107
dc.source.conferenceIEEE 18th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate30/11/2016
dc.source.conferencelocationSingapore Singapore
dc.source.endpage110
dc.title

Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring

dc.typeProceedings paper
dspace.entity.typePublication
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