Die to wafer 3D stacking for below 10μm pitch microbumps

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Authors
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy
Conference
IEEE International Conference on 3D System Integration - 3DIC
Title
Die to wafer 3D stacking for below 10μm pitch microbumps
Publication type
Proceedings paper
Embargo date
9999-12-31
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