dc.contributor.author | Kennes, Koen | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Guerrero, Alice | |
dc.contributor.author | Suhard, Samuel | |
dc.contributor.author | Bex, Pieter | |
dc.contributor.author | Brems, Steven | |
dc.contributor.author | Liu, Xiao | |
dc.contributor.author | Tussing, Sebastian | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2022-11-21T09:57:03Z | |
dc.date.available | 2022-09-17T02:52:10Z | |
dc.date.available | 2022-11-21T09:57:03Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000848765300316 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40445.2 | |
dc.source | WOS | |
dc.title | Carrier Systems for Collective Die-to-Wafer Bonding | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Kennes, Koen | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Suhard, Samuel | |
dc.contributor.imecauthor | Bex, Pieter | |
dc.contributor.imecauthor | Brems, Steven | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
dc.contributor.orcidimec | Brems, Steven::0000-0002-0282-8528 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/ECTC51906.2022.00324 | |
dc.identifier.eisbn | 978-1-6654-7943-1 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 2058 | |
dc.source.endpage | 2063 | |
dc.source.conference | 72nd IEEE Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 31-JUN 01, 2022 | |
dc.source.conferencelocation | San Diego | |
dc.source.journal | na | |
imec.availability | Published - imec | |