Browsing by author "Phommahaxay, Alain"

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020)

2D material integration in the semiconductor industry: Challenges and Solutions

Brems, Steven; Phommahaxay, Alain; Boulon, Marie-Emmanuelle; Verguts, Ken; Leonhardt, Alessandra; Kennes, Koen; Groven, Benjamin; Alessandri, Chiara; Wu, Cheng Han; Achra, Swati; Van Thourhout, Dries; Asselberghs, Inge; Pantouvaki, Marianna; Van Campenhout, Joris; Garello, Kevin; Parui, Subir; De Gendt, Stefan; Huyghebaert, Cedric (2019)

2D materials: roadmap to CMOS integration

Huyghebaert, Cedric; Schram, Tom; Smets, Quentin; Agarwal Kumar, Tarun; Verreck, Devin; Brems, Steven; Phommahaxay, Alain; Chiappe, Daniele; El Kazzi, Salim; Lockhart de la Rosa, Cesar Javier; Arutchelvan, Goutham; Cott, Daire; Ludwig, Jonathan; Gaur, Abhinav; Sutar, Surajit; Leonhardt, Alessandra; Marinov, Daniil; Lin, Dennis; Caymax, Matty; Asselberghs, Inge; Pourtois, Geoffrey; Radu, Iuliana (2018)

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Privett, Marc; Wallace, Daniel; Sood, Sumant; Bisson, Peter; Beyne, Eric; Travaly, Youssef; Swinnen, Bart (2010-11)

A 60GHz silicon micromachined cavity resonator with integrated tuning MEMS array

Dancila, Dragos; Ekkels, Phillip; Simon, Pascal; Jourdain, Anne; Phommahaxay, Alain; Rottenberg, Xavier; Huynen, Isabelle; Ocket, Ilja; Nauwelaers, Bart; Puers, Bob; De Raedt, Walter; Tilmans, Harrie (2009)

A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding

Bogaerts, Lieve; Phommahaxay, Alain; Rottenberg, Xavier; Naito, Yasyuki; De Coster, Jeroen; Varela Pedreira, Olalla; Van Hoovels, Nele; Cherman, Vladimir; Helin, Philippe; Onishi, K.; Tilmans, Harrie (2011)

A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

Podpod, Arnita; Slabbekoorn, John; Phommahaxay, Alain; Duval, Fabrice; Salahouelhadj, Abdellah; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018)

A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly

Capuz, Giovanni; Lofrano, Melina; Gerets, Carine; Duval, Fabrice; Bex, Pieter; Derakhshandeh, Jaber; Phommahaxay, Alain; Beyne, Eric; Miller, Andy; Vanstreels, Kris (2020)

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

Iacovo, Serena; D'have, Koen; Okudur, Oguzhan Orkut; De Vos, Joeri; Uhrmann, Thomas; Plach, Thomas; Conard, Thierry; Meersschaut, Johan; Bex, Pieter; Brems, Steven; Phommahaxay, Alain; Gonzalez, Mario; Witters, Liesbeth; Beyer, Gerald; Beyne, Eric (2023)

A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP

Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017)

Acoustic modulation during laser debonding of collective hybrid bonded dies

Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Bumueller, Dennis; Suhard, Samuel; Bex, Pieter; Tussing, Sebastian; Liu, Xiao; Beyer, Gerald; Beyne, Eric (2021)

Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding

Inoue, Fumihiro; Phommahaxay, Alain; Podpod, Arnita; Suhard, Samuel; Hoshino, Hitoshi; Berthold, Moeller; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2019)

Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology

Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; Phommahaxay, Alain; Sleeckx, Erik; De Vos, Joeri; Zinner, Dominik; Thomas, Wagenleitner; Thomas, Uhrmann; Markus, Wimplinger; Ben, Schoenaers; Andre, Stesmans; Afanasiev, Valeri; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018)