A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding

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Authors
Bogaerts, Lieve; Phommahaxay, Alain; Rottenberg, Xavier; Naito, Yasyuki; De Coster, Jeroen; Varela Pedreira, Olalla; Van Hoovels, Nele; Cherman, Vladimir; Helin, Philippe; Onishi, K.; Tilmans, Harrie
Conference
22nd Micromechanics and Micro systems Europe Workshop - MME
Title
A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding
Publication type
Proceedings paper
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