Publication:

A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding

Date

2011
Proceedings Paper
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dc.contributor.authorBogaerts, Lieve
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorRottenberg, Xavier
dc.contributor.authorNaito, Yasyuki
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorVan Hoovels, Nele
dc.contributor.authorCherman, Vladimir
dc.contributor.authorHelin, Philippe
dc.contributor.authorOnishi, K.
dc.contributor.authorTilmans, Harrie
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorRottenberg, Xavier
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVan Hoovels, Nele
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorHelin, Philippe
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.date.accessioned2021-10-19T12:36:39Z
dc.date.available2021-10-19T12:36:39Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18590
dc.source.beginpageB27
dc.source.conference22nd Micromechanics and Micro systems Europe Workshop - MME
dc.source.conferencedate19/06/2011
dc.source.conferencelocationTonsberg Norway
dc.title

A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding

dc.typeProceedings paper
dspace.entity.typePublication
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