Publication:

2D material integration in the semiconductor industry: Challenges and Solutions

Date

2019

Meeting abstract

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Author(s)

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Phommahaxay, Alain

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Boulon, Marie-Emmanuelle

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Leonhardt, Alessandra

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Groven, Benjamin

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Alessandri, Chiara

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;

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Van Thourhout, Dries

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Asselberghs, Inge

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Pantouvaki, Marianna

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Van Campenhout, Joris

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;

;

De Gendt, Stefan

;

Huyghebaert, Cedric

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Acq. date: 2026-10-04