Publication:

2D material integration in the semiconductor industry: Challenges and Solutions

Date

2019
Meeting abstract
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dc.contributor.authorBrems, Steven
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBoulon, Marie-Emmanuelle
dc.contributor.authorVerguts, Ken
dc.contributor.authorLeonhardt, Alessandra
dc.contributor.authorKennes, Koen
dc.contributor.authorGroven, Benjamin
dc.contributor.authorAlessandri, Chiara
dc.contributor.authorWu, Cheng Han
dc.contributor.authorAchra, Swati
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorAsselberghs, Inge
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorGarello, Kevin
dc.contributor.authorParui, Subir
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBoulon, Marie-Emmanuelle
dc.contributor.imecauthorLeonhardt, Alessandra
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorGroven, Benjamin
dc.contributor.imecauthorAlessandri, Chiara
dc.contributor.imecauthorWu, Cheng Han
dc.contributor.imecauthorAchra, Swati
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorAsselberghs, Inge
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorGarello, Kevin
dc.contributor.imecauthorParui, Subir
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecBoulon, Marie-Emmanuelle::0000-0003-1837-0803
dc.contributor.orcidimecGroven, Benjamin::0000-0002-5781-7594
dc.contributor.orcidimecAchra, Swati::0000-0002-4837-6109
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.date.accessioned2021-10-27T07:44:44Z
dc.date.available2021-10-27T07:44:44Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32614
dc.source.conferenceGraphene week 2019
dc.source.conferencedate23/09/2019
dc.source.conferencelocationHelsinki Finland
dc.title

2D material integration in the semiconductor industry: Challenges and Solutions

dc.typeMeeting abstract
dspace.entity.typePublication
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