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Conference contributions
2D material integration in the semiconductor industry: Challenges and Solutions
Publication:
2D material integration in the semiconductor industry: Challenges and Solutions
Date
2019
Meeting abstract
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Brems, Steven
;
Phommahaxay, Alain
;
Boulon, Marie-Emmanuelle
;
Verguts, Ken
;
Leonhardt, Alessandra
;
Kennes, Koen
;
Groven, Benjamin
;
Alessandri, Chiara
;
Wu, Cheng Han
;
Achra, Swati
;
Van Thourhout, Dries
;
Asselberghs, Inge
;
Pantouvaki, Marianna
;
Van Campenhout, Joris
;
Garello, Kevin
;
Parui, Subir
;
De Gendt, Stefan
;
Huyghebaert, Cedric
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Abstract
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2265
since deposited on 2021-10-27
Acq. date: 2025-10-23
Citations
Metrics
Views
2265
since deposited on 2021-10-27
Acq. date: 2025-10-23
Citations