Browsing by author "Phommahaxay, Alain"
Now showing items 21-40 of 94
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Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric (2020) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
Cost components for 3D system integration
Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Rebibis, Kenneth June; Marinissen, Erik Jan; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Soussan, Philippe; Huyghebaert, Cedric; Phommahaxay, Alain (2010-12) -
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Huyghebaert, Cedric; Van Olmen, Jan; Civale, Yann; Phommahaxay, Alain; Jourdain, Anne; Sood, Sumant; Farrens, Shari; Soussan, Philippe (2010) -
Cu/Sn microbumps interconnect for 3D TSV chip stacking
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe (2010) -
Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics
Phommahaxay, Alain; De Wolf, Ingrid; Djuric, Tatjana; Hoffrogge, Peter; Brand, Sebastien; Czurratis, Peter; Philipsen, Harold; Beyer, Gerald; Struyf, Herbert; Beyne, Eric (2014) -
Demonstration of a collective hybrid die-to-wafer integration
Suhard, Samuel; Phommahaxay, Alain; Kennes, Koen; Bex, Pieter; Fodor, Ferenc; Beyne, Eric; Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyer, Gerald (2020) -
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021) -
Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal
Phommahaxay, Alain; Nakamura, Atsushi; Jourdain, Anne; Verbinnen, Greet; Kamochi, Yoshitaka; Koyama, Ichiro; Iwai, Yu; Sawano, Mitsuru; Tan, Shiro; Miller, Andy; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2015) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Development of compression molding process for Fan-Out wafer level packaging
Bertheau, Julien; Duval, Fabrice; Kubota, Tadashi; Bex, Pieter; Kennes, Koen; Phommahaxay, Alain; Podpod, Arnita; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
Development of multi-stack dielectric wafer bonding
Peng, Lan; Kim, Soon-Wook; Inoue, Fumihiro; Wang, Teng; Phommahaxay, Alain; Verdonck, Patrick; Jourdain, Anne; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Soules, Mike; Lutter, Stefan (2016) -
Direct bonding of low temperature heterogeneous dielectrics
Iacovo, Serena; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Direct Bonding Using Low Temperature SiCN Dielectrics
Iacovo, Serena; Nagano, Fuya; Channam, Venkat Sunil Kumar; Walsby, Edward; Crook, Kath; Buchanan, Keith; Jourdain, Anne; Vanstreels, Kris; Phommahaxay, Alain; Beyne, Eric (2022) -
Edge shape control for bonded wafer
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2017) -
Edge trimming for surface activated dielectric bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Visker, Jakob; Peng, Lan; Moeller, Berthold; Yokoyama, Yokoyama; Phommahaxay, Alain; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2017) -
Edge trimming induced defects on direct bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2018) -
Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias
Huyghebaert, Cedric; Van Olmen, Jan; Okoro, Chukwudi; Coenen, Jens; Jourdain, Anne; Van Cauwenberghe, Marc; Agarwal, Rahul; Phommahaxay, Alain; Stucchi, Michele; Soussan, Philippe (2010)