Publication:

Development of multi-stack dielectric wafer bonding

Date

2016

Proceedings Paper

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Files

33383.pdf 959.84 KB

Author(s)

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Inoue, Fumihiro

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Phommahaxay, Alain

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Verdonck, Patrick

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Struyf, Herbert

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Metrics

1930 since deposited on 2021-10-23

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Acq. date: 2025-12-11