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Development of multi-stack dielectric wafer bonding
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Authors
Peng, Lan
;
Kim, Soon-Wook
;
Inoue, Fumihiro
;
Wang, Teng
;
Phommahaxay, Alain
;
Verdonck, Patrick
;
Jourdain, Anne
;
Sleeckx, Erik
;
Struyf, Herbert
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
;
Soules, Mike
;
Lutter, Stefan
Conference
17th International Conference on Electronic Packaging Technology - ICEPT
Title
Development of multi-stack dielectric wafer bonding
Publication type
Proceedings paper
Embargo date
9999-12-31
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