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Conference contributions
Development of multi-stack dielectric wafer bonding
Publication:
Development of multi-stack dielectric wafer bonding
Date
2016
Proceedings Paper
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33383.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Peng, Lan
;
Kim, Soon-Wook
;
Inoue, Fumihiro
;
Wang, Teng
;
Phommahaxay, Alain
;
Verdonck, Patrick
;
Jourdain, Anne
;
Sleeckx, Erik
;
Struyf, Herbert
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
;
Soules, Mike
;
Lutter, Stefan
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1926
since deposited on 2021-10-23
Acq. date: 2025-10-27
Citations
Metrics
Views
1926
since deposited on 2021-10-23
Acq. date: 2025-10-27
Citations