Publication:

Development of multi-stack dielectric wafer bonding

Date

2016
Proceedings Paper
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dc.contributor.authorPeng, Lan
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorWang, Teng
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorJourdain, Anne
dc.contributor.authorSleeckx, Erik
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorSoules, Mike
dc.contributor.authorLutter, Stefan
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T13:37:32Z
dc.date.available2021-10-23T13:37:32Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27130
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7583082/
dc.source.beginpage22
dc.source.conference17th International Conference on Electronic Packaging Technology - ICEPT
dc.source.conferencedate16/08/2016
dc.source.conferencelocationWuhan China
dc.source.endpage25
dc.title

Development of multi-stack dielectric wafer bonding

dc.typeProceedings paper
dspace.entity.typePublication
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