Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding

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Authors
Huyghebaert, Cedric; Van Olmen, Jan; Civale, Yann; Phommahaxay, Alain; Jourdain, Anne; Sood, Sumant; Farrens, Shari; Soussan, Philippe
Conference
IEEE International Interconnect Technology Conference - IITC
Title
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Publication type
Proceedings paper
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