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Conference contributions
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Publication:
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Date
2010
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Huyghebaert, Cedric
;
Van Olmen, Jan
;
Civale, Yann
;
Phommahaxay, Alain
;
Jourdain, Anne
;
Sood, Sumant
;
Farrens, Shari
;
Soussan, Philippe
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1969
since deposited on 2021-10-18
Acq. date: 2025-10-27
Citations
Metrics
Views
1969
since deposited on 2021-10-18
Acq. date: 2025-10-27
Citations