Publication:
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Date
| dc.contributor.author | Huyghebaert, Cedric | |
| dc.contributor.author | Van Olmen, Jan | |
| dc.contributor.author | Civale, Yann | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | Jourdain, Anne | |
| dc.contributor.author | Sood, Sumant | |
| dc.contributor.author | Farrens, Shari | |
| dc.contributor.author | Soussan, Philippe | |
| dc.contributor.imecauthor | Huyghebaert, Cedric | |
| dc.contributor.imecauthor | Van Olmen, Jan | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | Jourdain, Anne | |
| dc.contributor.imecauthor | Soussan, Philippe | |
| dc.contributor.orcidimec | Huyghebaert, Cedric::0000-0001-6043-7130 | |
| dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
| dc.date.accessioned | 2021-10-18T17:16:00Z | |
| dc.date.available | 2021-10-18T17:16:00Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17298 | |
| dc.source.conference | IEEE International Interconnect Technology Conference - IITC | |
| dc.source.conferencedate | 6/06/2010 | |
| dc.source.conferencelocation | San-Fransisco, CA USA | |
| dc.title | Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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