Authors
Iacovo, Serena;
Peng, Lan;
Phommahaxay, Alain;
Inoue, Fumihiro;
Verdonck, Patrick;
Kim, Soon-Wook;
Sleeckx, Erik;
Miller, Andy;
Beyer, Gerald;
Beyne, Eric
EISBN
978-1-7281-1498-9
ISSN
0569-5503
Conference
69th IEEE Electronic Components and Technology Conference (ECTC)
Journal
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Title
Direct bonding of low temperature heterogeneous dielectrics
Publication type
Proceedings paper
Embargo date
9999-12-31