dc.contributor.author | Iacovo, Serena | |
dc.contributor.author | Peng, Lan | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Inoue, Fumihiro | |
dc.contributor.author | Verdonck, Patrick | |
dc.contributor.author | Kim, Soon-Wook | |
dc.contributor.author | Sleeckx, Erik | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2022-04-04T09:22:07Z | |
dc.date.available | 2022-04-01T15:23:06Z | |
dc.date.available | 2022-04-04T09:22:07Z | |
dc.date.issued | 2019 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000503261500332 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39563.2 | |
dc.source | WOS | |
dc.title | Direct bonding of low temperature heterogeneous dielectrics | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Iacovo, Serena | |
dc.contributor.imecauthor | Peng, Lan | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Inoue, Fumihiro | |
dc.contributor.imecauthor | Verdonck, Patrick | |
dc.contributor.imecauthor | Kim, Soon-Wook | |
dc.contributor.imecauthor | Sleeckx, Erik | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Inoue, Fumihiro::0000-0003-2292-846X | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
dc.contributor.orcidimec | Verdonck, Patrick::0000-0003-2454-0602 | |
dc.contributor.orcidimec | Sleeckx, Erik::0000-0003-2560-6132 | |
dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
dc.date.embargo | 9999-12-31 | |
dc.identifier.doi | 10.1109/ECTC.2019.00-16 | |
dc.identifier.eisbn | 978-1-7281-1498-9 | |
dc.source.numberofpages | 7 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 2206 | |
dc.source.endpage | 2212 | |
dc.source.conference | 69th IEEE Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 29-31, 2019 | |
dc.source.conferencelocation | Las Vegas | |
dc.source.journal | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) | |
imec.availability | Published - open access | |