Browsing by author "Kim, Soon-Wook"

3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding

Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Kim, Soon-Wook; de Vos, Joeri; Van der Plas, Geert; Beyne, Eric (2020)

3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes

Chen, Rongmei; Weckx, Pieter; Salahuddin, Shairfe Muhammad; Kim, Soon-Wook; Sisto, Giuliano; Van der Plas, Geert; Stucchi, Michele; Baert, Rogier; Debacker, Peter; Na, Myung Hee; Ryckaert, Julien; Milojevic, Dragomir; Beyne, Eric (2020)

3D-SoC integration utilizing high accuracy wafer level bonding

Peng, Lan; Kim, Soon-Wook; Heylen, Nancy; Reichardt, Maik; Kurz, Florian; Wagenleitner, Thomas; Sleeckx, Erik; Struyf, Herbert; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016)

Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology

Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; Phommahaxay, Alain; Sleeckx, Erik; De Vos, Joeri; Zinner, Dominik; Thomas, Wagenleitner; Thomas, Uhrmann; Markus, Wimplinger; Ben, Schoenaers; Andre, Stesmans; Afanasiev, Valeri; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018)

Area-Selective Electroless Deposition of Cu for Hybrid Bonding

Inoue, Fumihiro; Iacovo, Serena; El-Mekki, Zaid; Kim, Soon-Wook; Struyf, Herbert; Beyne, Eric (2021)

Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding

Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric (2017-03)

Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

Iacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jurgen; Fehkuhrer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri; Phommahaxay, Alain; Beyne, Eric (2021)

Characterization of inorganic dielectric layers for low thermal budget wafer to wafer bonding

Inoue, Fumihiro; Peng, Lan; Phommahaxay, Alain; Kim, Soon-Wook; De Vos, Joeri; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017)

Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.

De Wolf, Ingrid; Khaled, Ahmad; Kim, Soon-Wook; Beyne, Eric; Kögel, Michael; Brand, Sebastian; Djuric-Rissner, Tatiana; Ingo, Wiesler (2018-11)

Development of multi-stack dielectric wafer bonding

Peng, Lan; Kim, Soon-Wook; Inoue, Fumihiro; Wang, Teng; Phommahaxay, Alain; Verdonck, Patrick; Jourdain, Anne; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Soules, Mike; Lutter, Stefan (2016)

Direct bonding of low temperature heterogeneous dielectrics

Iacovo, Serena; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019)

Electromigration behavior of 2μm sub-micron Cu/SiCN hybrid bonds

De Messemaeker, Joke; Kim, Soon-Wook; Stucchi, Michele; Beyer, Gerald; Beyne, Eric; Croes, Kristof (2019)

Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits

De Messemaeker, Joke; Kim, Soon-Wook; Stucchi, Michele; Beyer, Gerald; Beyne, Eric; Croes, Kristof (2018)

Fault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alteration

Jacobs, Kristof J.P.; Kim, Soon-Wook; De Wolf, Ingrid; Beyne, Eric (2020)