Publication:
Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits
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2152 since deposited on 2021-10-25
18last month
6last week
Acq. date: 2026-08-30
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Statistics
Views
2152 since deposited on 2021-10-25
18last month
6last week
Acq. date: 2026-08-30
Citations