Publication:
Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits
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2131 since deposited on 2021-10-25
9last month
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Acq. date: 2026-07-18
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Statistics
Views
2131 since deposited on 2021-10-25
9last month
7last week
Acq. date: 2026-07-18
Citations