Publication:
Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits
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2099 since deposited on 2021-10-25
3last month
Acq. date: 2026-02-25
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Statistics
Views
2099 since deposited on 2021-10-25
3last month
Acq. date: 2026-02-25
Citations