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Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits
Publication:
Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits
Date
2018
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Messemaeker, Joke
;
Kim, Soon-Wook
;
Stucchi, Michele
;
Beyer, Gerald
;
Beyne, Eric
;
Croes, Kristof
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Abstract
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2077
since deposited on 2021-10-25
Acq. date: 2025-10-27
Citations
Metrics
Views
2077
since deposited on 2021-10-25
Acq. date: 2025-10-27
Citations