Publication:
Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits
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2087 since deposited on 2021-10-25
3last month
Acq. date: 2025-12-15
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Metrics
Views
2087 since deposited on 2021-10-25
3last month
Acq. date: 2025-12-15
Citations