Authors

De Messemaeker, Joke; Kim, Soon-Wook; Stucchi, Michele; Beyer, Gerald; Beyne, Eric; Croes, Kristof

Conference

IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)

Title

Electromigration behavior of 2μm sub-micron Cu/SiCN hybrid bonds

Publication type

Proceedings paper

Embargo date

9999-12-31