Publication:
Electromigration behavior of 2μm sub-micron Cu/SiCN hybrid bonds
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Acq. date: 2026-07-14
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3 since deposited on 2021-10-27
Acq. date: 2026-07-14
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2035 since deposited on 2021-10-27
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Acq. date: 2026-07-14
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