Browsing by author "Kim, Soon-Wook"
Now showing items 21-31 of 31
-
Novel failure analysis techniques for 1.8 μm pitch wafer-to-wafer bonding
Schmidt, Christian; Lechner, Lorenz; De Wolf, Ingrid; Kim, Soon-Wook; Beyne, Eric (2018) -
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics
Kim, Soon-Wook; Peng, Lan; Miller, Andy; Beyer, Gerald; Beyne, Eric; Lee, Chung Sun (2015) -
Pre-bonding characterization of SiCN enabled wafer stacking
Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; De Vos, Joeri; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Process complexity and cost considerations of multi-layer die stacks
Velenis, Dimitrios; De Vos, Joeri; Kim, Soon-Wook; Derakhshandeh, Jaber; Bex, Pieter; Capuz, Giovanni; Suhard, Samuel; Rebibis, Kenneth June; Van Huylenbroeck, Stefaan; Marinissen, Erik Jan; Phommahaxay, Alain; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Beyne, Eric (2019) -
Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
Beyne, Eric; Kim, Soon-Wook; Peng, Lan; Heylen, Nancy; De Messemaeker, Joke; Okudur, Oguzhan Orkut; Phommahaxay, Alain; Kim, Tae-Gon; Stucchi, Michele; Velenis, Dimitrios; Miller, Andy; Beyer, Gerald (2017) -
Texture control for Cu hybrid bonding pads using a PVD Cu process
De Messemaeker, Joke; Jourdan, Nicolas; Nolmans, Philip; Kim, Soon-Wook; Beyer, Gerald (2019) -
The unique properties of SiCN as bonding material for hybrid bonding
Iacovo, Serena; Kim, Soon-Wook; Nagano, Fuya; Peng, Lan; Inoue, Fumihiro; Phommahaxay, Alain; Beyne, Eric (2021) -
Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric (2016-05) -
Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits
Okudur, Oguzhan Orkut; De Messemaeker, Joke; Salahouelhadj, Abdellah; Gonzalez, Mario; Zahedmanesh, Houman; Varela Pedreira, Olalla; Kim, Soon-Wook; Vanstreels, Kris; Beyne, Eric; De Wolf, Ingrid (2017) -
Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process
Kim, Soon-Wook; Detalle, Mikael; Peng, Lan; Nolmans, Philip; Heylen, Nancy; Velenis, Dimitrios; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
W2W permanent stacking for 3D system integration
Peng, Lan; Kim, Soon-Wook; Soules, Michael; Gabriel, Markus; Zoberbier, Margarete; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric (2014)