Authors

Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric

Conference

15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm

Title

Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding

Publication type

Proceedings paper