Publication:
Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding
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1966 since deposited on 2021-10-23
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Acq. date: 2026-04-05
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Statistics
Views
1966 since deposited on 2021-10-23
2last month
1last week
Acq. date: 2026-04-05
Citations