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Pre-bonding characterization of SiCN enabled wafer stacking
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Authors
Peng, Lan
;
Kim, Soon-Wook
;
Iacovo, Serena
;
Inoue, Fumihiro
;
De Vos, Joeri
;
Sleeckx, Erik
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
Conference
2019 6th International Workshop on Low Temperature Bonding for 3D Integration LTB-3D 2019
Title
Pre-bonding characterization of SiCN enabled wafer stacking
Publication type
Proceedings paper
Embargo date
9999-12-31
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