Publication:

Pre-bonding characterization of SiCN enabled wafer stacking

Date

2019
Proceedings Paper
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Author(s)

Peng, Lan  
;
Kim, Soon-Wook  
;
Iacovo, Serena  
;
Inoue, Fumihiro  
;
De Vos, Joeri  
;
Sleeckx, Erik  
;
Miller, Andy  
;
Beyer, Gerald  
;
Beyne, Eric  

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1888 since deposited on 2021-10-27
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