Publication:

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Date

2017

Proceedings Paper

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Files

36728.pdf 1.76 MB

Author(s)

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De Messemaeker, Joke

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Okudur, Oguzhan Orkut

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Phommahaxay, Alain

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Stucchi, Michele

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Velenis, Dimitrios

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Metrics

2056 since deposited on 2021-10-24

3last month

Acq. date: 2026-01-10