Publication:
Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
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2054 since deposited on 2021-10-24
2last month
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Acq. date: 2025-12-15
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2054 since deposited on 2021-10-24
2last month
1last week
Acq. date: 2025-12-15
Citations