Publication:

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Date

2017
Proceedings Paper
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Author(s)

Beyne, Eric  
;
Kim, Soon-Wook  
;
Peng, Lan  
;
Heylen, Nancy  
;
De Messemaeker, Joke  
;
Okudur, Oguzhan Orkut  
;
Phommahaxay, Alain  
;
Kim, Tae-Gon
;
Stucchi, Michele  
;
Velenis, Dimitrios  
;
Miller, Andy  
;
Beyer, Gerald  

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Abstract

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