Publication:
Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits
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2420 since deposited on 2021-10-24
13last month
3last week
Acq. date: 2026-01-08
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Views
2420 since deposited on 2021-10-24
13last month
3last week
Acq. date: 2026-01-08
Citations