Publication:

Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits

Date

2017

Meeting abstract

Simple item page Full metadata Statistics

Author(s)

Okudur, Oguzhan Orkut

;

De Messemaeker, Joke

;

Salahouelhadj, Abdellah

;

Gonzalez, Mario

;

Zahedmanesh, Houman

;

Varela Pedreira, Olalla

;

;

Vanstreels, Kris

;

;

De Wolf, Ingrid

Statistics

2546 since deposited on 2021-10-24

45last month

19last week

Acq. date: 2026-08-27