Publication:

Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits

Date

2017

Meeting abstract

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Author(s)

Okudur, Oguzhan Orkut

;

De Messemaeker, Joke

;

Salahouelhadj, Abdellah

;

Gonzalez, Mario

;

Zahedmanesh, Houman

;

Varela Pedreira, Olalla

;

;

Vanstreels, Kris

;

;

De Wolf, Ingrid

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Acq. date: 2026-02-24