Authors

Kim, Soon-Wook; Detalle, Mikael; Peng, Lan; Nolmans, Philip; Heylen, Nancy; Velenis, Dimitrios; Miller, Andy; Beyer, Gerald; Beyne, Eric

Conference

IEEE 66th Electronic Components and Technology Conference - ECTC

Title

Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process

Publication type

Proceedings paper

Embargo date

9999-12-31