Publication:

Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process

Date

2016
Proceedings Paper
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dc.contributor.authorKim, Soon-Wook
dc.contributor.authorDetalle, Mikael
dc.contributor.authorPeng, Lan
dc.contributor.authorNolmans, Philip
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T11:48:00Z
dc.date.available2021-10-23T11:48:00Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26831
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545574/?arnumber=7545574
dc.source.beginpage1179
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage1185
dc.title

Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process

dc.typeProceedings paper
dspace.entity.typePublication
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