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Conference contributions
Nanotopography control for wafer-to-wafer hybrid bonding by CMP
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Nanotopography control for wafer-to-wafer hybrid bonding by CMP
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Date
2017
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Heylen, Nancy
;
Kim, Soon-Wook
;
Kim, Tae-Gon
;
Peng, Lan
;
Nolmans, Philip
;
Struyf, Herbert
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Sofie
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1937
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Acq. date: 2026-01-08
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Views
1937
since deposited on 2021-10-24
2
last month
1
last week
Acq. date: 2026-01-08
Citations