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Nanotopography control for wafer-to-wafer hybrid bonding by CMP

Date

2017
Meeting abstract
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dc.contributor.authorHeylen, Nancy
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorKim, Tae-Gon
dc.contributor.authorPeng, Lan
dc.contributor.authorNolmans, Philip
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Sofie
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Sofie
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.date.accessioned2021-10-24T05:41:28Z
dc.date.available2021-10-24T05:41:28Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28500
dc.identifier.urlhttp://conference.vde.com/icpt/cfp/Documents/ICPT%202017%20Program.pdf
dc.source.conferenceInternational Conference on Planarization / CMP Technology - ICPT 2017
dc.source.conferencedate11/10/2017
dc.source.conferencelocationLeuven Belgium
dc.title

Nanotopography control for wafer-to-wafer hybrid bonding by CMP

dc.typeMeeting abstract
dspace.entity.typePublication
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