Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.

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Authors
De Wolf, Ingrid; Khaled, Ahmad; Kim, Soon-Wook; Beyne, Eric; Kögel, Michael; Brand, Sebastian; Djuric-Rissner, Tatiana; Ingo, Wiesler
Conference
International Symposium for Testing and Failure Analysis - ISTFA
Title
Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.
Publication type
Proceedings paper
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