Publication:

Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.

Date

2018-11
Proceedings Paper
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dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorBeyne, Eric
dc.contributor.authorKögel, Michael
dc.contributor.authorBrand, Sebastian
dc.contributor.authorDjuric-Rissner, Tatiana
dc.contributor.authorIngo, Wiesler
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-25T17:53:29Z
dc.date.available2021-10-25T17:53:29Z
dc.date.issued2018-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30566
dc.source.beginpage8
dc.source.conferenceInternational Symposium for Testing and Failure Analysis - ISTFA
dc.source.conferencedate28/10/2018
dc.source.conferencelocationPhoenix, AZ USA
dc.source.endpage11
dc.title

Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.

dc.typeProceedings paper
dspace.entity.typePublication
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