Publication:

Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.

Date

2018-11

Proceedings Paper

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Author(s)

De Wolf, Ingrid

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Kögel, Michael

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Brand, Sebastian

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Djuric-Rissner, Tatiana

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Statistics

1888 since deposited on 2021-10-25

Acq. date: 2026-02-24