Browsing by author "Peng, Lan"
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3D integration technology using W2W direct bonding and TSV
Pham, Nga; Sabuncuoglu Tezcan, Deniz; Jamieson, Geraldine; Tutunjyan, Nina; Peng, Lan; Volkaerts, Danny (2015) -
3D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability
Vandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Zhicheng; Witters, Liesbeth; Walke, Amey; Li, Waikin; Peng, Lan; Deshpande, Veeresh Vidyadhar; Bufler, Fabian; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Ritzenthaler, Romain; Besnard, Guillaume; Schwarzenbach, Walter; Gaudin, Gweltaz; Radu, Ionut; Nguyen, Bich-Yen; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018-11) -
3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability
Vandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Zhicheng; Witters, Liesbeth; Walke, Amey; Li, Waikin; Peng, Lan; Deshpande, Veeresh Vidyadhar; Bufler, Fabian; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Ritzenthaler, Romain; Besnard, Guillaume; Schwarzenbach, Walter; Gaudin, Gweltaz; Radu, Ionut; Nguyen, Bich-Yen; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018) -
3D-SoC integration utilizing high accuracy wafer level bonding
Peng, Lan; Kim, Soon-Wook; Heylen, Nancy; Reichardt, Maik; Kurz, Florian; Wagenleitner, Thomas; Sleeckx, Erik; Struyf, Herbert; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
A novel integration scheme for wafer singulation and selective processing using temporary dry film resist
La Grappe, Alexandre; Visker, Evert; Redolfi, Augusto; Peng, Lan; Muga, Karthik; Huls, David; Vanhaelemeersch, Serge; Lauwers, Anne; Ackaert, Jan (2021) -
Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; Phommahaxay, Alain; Sleeckx, Erik; De Vos, Joeri; Zinner, Dominik; Thomas, Wagenleitner; Thomas, Uhrmann; Markus, Wimplinger; Ben, Schoenaers; Andre, Stesmans; Afanasiev, Valeri; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
Bonding yield analysis of enclosed structures
Visker, Jakob; Fiorentino, Giuseppe; Peng, Lan (2018) -
Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Vandooren, Anne; Wu, Zhicheng; Khaled, Ahmad; Franco, Jacopo; Parvais, Bertrand; Li, W.; Witters, Liesbeth; Walke, Amey; Peng, Lan; Rassoul, Nouredine; Matagne, Philippe; Jamieson, Geraldine; Inoue, Fumihiro; Nguyen, B.Y.; Debruyn, Haroen; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Radisic, Dunja; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Besnard, G.; Schwarzenbach, W.; Gaudin, G.; Radu, Iuliana; Waldron, Niamh; De Heyn, Vincent; Demuynck, Steven; Boemmels, Juergen; Ryckaert, Julien; Collaert, Nadine; Mocuta, Dan (2019) -
Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric (2017-03) -
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Iacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jurgen; Fehkuhrer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri; Phommahaxay, Alain; Beyne, Eric (2021) -
Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Inoue, Fumihiro; Jourdain, Anne; De Vos, Joeri; Peng, Lan; Liebens, Maarten; Armini, Silvia; Uedono, Akira; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016) -
Characterization of inorganic dielectric layers for low thermal budget wafer to wafer bonding
Inoue, Fumihiro; Peng, Lan; Phommahaxay, Alain; Kim, Soon-Wook; De Vos, Joeri; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
Copper oxide direct bonding of 200 mm CMOS wafers with five metal levels and TSVs: morphological and electrical characterization
Cavaco, Celso; Peng, Lan; Lavizzari, Simone; Claes, Jesse; Van Hoovels, Nele; Guerrieri, Stefano; Sabuncuoglu Tezcan, Deniz; Osman, Haris (2016) -
Copper oxide direct bonding of 200mm CMOS wafers: morphological and electrical characterization
Cavaco, Celso; Peng, Lan; De Leersnijder, Koen; Guerrieri, Stefano; Sabuncuoglu Tezcan, Deniz; Osman, Haris (2015) -
Defect identification in bonding surface layer by positron annihilation spectroscopy
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Nagano, Fuya; Sleeckx, Erik; Beyer, Gerald; Uedono, Akira; Beyne, Eric (2019) -
Development of multi-stack dielectric wafer bonding
Peng, Lan; Kim, Soon-Wook; Inoue, Fumihiro; Wang, Teng; Phommahaxay, Alain; Verdonck, Patrick; Jourdain, Anne; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Soules, Mike; Lutter, Stefan (2016) -
Development of wafer-level adhesive bonding for fine-pitch 3-D connections
Bertheau, Julien; Inoue, Fumihiro; Iacovo, Serena; Peng, Lan; Derakhshandeh, Jaber; Beyne, Eric (2017) -
Direct bonding of low temperature heterogeneous dielectrics
Iacovo, Serena; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Double-gate Si junction-less n-type transistor for high performance Cu-BEOL compatible applications using 3D sequential integration
Vandooren, Anne; Witters, Liesbeth; Vecchio, Emma; Kunnen, Eddy; Hellings, Geert; Peng, Lan; Inoue, Fumihiro; Li, Waikin; Waldron, Niamh; Mocuta, Dan; Collaert, Nadine (2017) -
Edge shape control for bonded wafer
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2017)