Development of wafer-level adhesive bonding for fine-pitch 3-D connections

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Authors
Bertheau, Julien; Inoue, Fumihiro; Iacovo, Serena; Peng, Lan; Derakhshandeh, Jaber; Beyne, Eric
Conference
The International Conference on Wafer Bonding - Waferbond
Title
Development of wafer-level adhesive bonding for fine-pitch 3-D connections
Publication type
Meeting abstract
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