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Development of wafer-level adhesive bonding for fine-pitch 3-D connections
Publication:
Development of wafer-level adhesive bonding for fine-pitch 3-D connections
Date
2017
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Bertheau, Julien
;
Inoue, Fumihiro
;
Iacovo, Serena
;
Peng, Lan
;
Derakhshandeh, Jaber
;
Beyne, Eric
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1963
since deposited on 2021-10-24
Acq. date: 2025-10-27
Citations
Metrics
Views
1963
since deposited on 2021-10-24
Acq. date: 2025-10-27
Citations