Authors

La Grappe, Alexandre; Visker, Evert; Redolfi, Augusto; Peng, Lan; Muga, Karthik; Huls, David; Vanhaelemeersch, Serge; Lauwers, Anne; Ackaert, Jan

DOI

10.1109/ECTC32696.2021.00136

EISBN

978-0-7381-4523-5

ISSN

0569-5503

Conference

IEEE 71st Electronic Components and Technology Conference (ECTC)

Journal

na

Title

A novel integration scheme for wafer singulation and selective processing using temporary dry film resist

Publication type

Proceedings paper