Publication:

A novel integration scheme for wafer singulation and selective processing using temporary dry film resist

Date

2021
Proceedings Paper
https://doi.org/10.1109/ECTC32696.2021.00136
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dc.contributor.authorLa Grappe, Alexandre
dc.contributor.authorVisker, Evert
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorPeng, Lan
dc.contributor.authorMuga, Karthik
dc.contributor.authorHuls, David
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorLauwers, Anne
dc.contributor.authorAckaert, Jan
dc.contributor.imecauthorLa Grappe, Alexandre
dc.contributor.imecauthorVisker, Evert
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorMuga, Karthik
dc.contributor.imecauthorHuls, David
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorLauwers, Anne
dc.contributor.imecauthorAckaert, Jan
dc.contributor.orcidimecVisker, Evert::0000-0002-1096-9670
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2022-03-16T14:47:59Z
dc.date.available2022-03-16T14:47:59Z
dc.date.issued2021
dc.identifier.doi10.1109/ECTC32696.2021.00136
dc.identifier.eisbn978-0-7381-4523-5
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39459
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage793
dc.source.conferenceIEEE 71st Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 01-JUL 04, 2021
dc.source.conferencelocationVirtual
dc.source.endpage796
dc.source.journalna
dc.source.numberofpages4
dc.title

A novel integration scheme for wafer singulation and selective processing using temporary dry film resist

dc.typeProceedings paper
dspace.entity.typePublication
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