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Conference contributions
3D integration technology using W2W direct bonding and TSV
Publication:
3D integration technology using W2W direct bonding and TSV
Date
2015
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Pham, Nga
;
Sabuncuoglu Tezcan, Deniz
;
Jamieson, Geraldine
;
Tutunjyan, Nina
;
Peng, Lan
;
Volkaerts, Danny
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2174
since deposited on 2021-10-22
Acq. date: 2025-10-27
Citations
Metrics
Views
2174
since deposited on 2021-10-22
Acq. date: 2025-10-27
Citations