Publication:

3D integration technology using W2W direct bonding and TSV

Date

2015
Proceedings Paper
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dc.contributor.authorPham, Nga
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorPeng, Lan
dc.contributor.authorVolkaerts, Danny
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorPeng, Lan
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.date.accessioned2021-10-22T21:48:57Z
dc.date.available2021-10-22T21:48:57Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25757
dc.source.conferenceElectronics Packaging Technology Conference - EPTC
dc.source.conferencedate2/12/2015
dc.source.conferencelocationSingapore Singapore
dc.title

3D integration technology using W2W direct bonding and TSV

dc.typeProceedings paper
dspace.entity.typePublication
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