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Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics
Publication:
Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics
Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Phommahaxay, Alain
;
De Wolf, Ingrid
;
Djuric, Tatjana
;
Hoffrogge, Peter
;
Brand, Sebastien
;
Czurratis, Peter
;
Philipsen, Harold
;
Beyer, Gerald
;
Struyf, Herbert
;
Beyne, Eric
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1909
since deposited on 2021-10-22
Acq. date: 2025-10-29
Citations
Metrics
Views
1909
since deposited on 2021-10-22
Acq. date: 2025-10-29
Citations