Publication:

Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics

Date

2014
Proceedings Paper
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dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorDjuric, Tatjana
dc.contributor.authorHoffrogge, Peter
dc.contributor.authorBrand, Sebastien
dc.contributor.authorCzurratis, Peter
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorBeyer, Gerald
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T04:45:18Z
dc.date.available2021-10-22T04:45:18Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24386
dc.identifier.urlhttp://dx.doi.org/10.1109/ECTC.2014.6897385
dc.source.beginpage850
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage855
dc.title

Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics

dc.typeProceedings paper
dspace.entity.typePublication
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