Browsing by author "Kennes, Koen"
Now showing items 1-15 of 15
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2D material integration in the semiconductor industry: Challenges and Solutions
Brems, Steven; Phommahaxay, Alain; Boulon, Marie-Emmanuelle; Verguts, Ken; Leonhardt, Alessandra; Kennes, Koen; Groven, Benjamin; Alessandri, Chiara; Wu, Cheng Han; Achra, Swati; Van Thourhout, Dries; Asselberghs, Inge; Pantouvaki, Marianna; Van Campenhout, Joris; Garello, Kevin; Parui, Subir; De Gendt, Stefan; Huyghebaert, Cedric (2019) -
Acoustic modulation during laser debonding of collective hybrid bonded dies
Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Bumueller, Dennis; Suhard, Samuel; Bex, Pieter; Tussing, Sebastian; Liu, Xiao; Beyer, Gerald; Beyne, Eric (2021) -
Carrier Systems for Collective Die-to-Wafer Bonding
Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Suhard, Samuel; Bex, Pieter; Brems, Steven; Liu, Xiao; Tussing, Sebastian; Beyer, Gerald; Beyne, Eric (2022) -
Demonstration of a collective hybrid die-to-wafer integration
Suhard, Samuel; Phommahaxay, Alain; Kennes, Koen; Bex, Pieter; Fodor, Ferenc; Beyne, Eric; Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyer, Gerald (2020) -
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021) -
Development of compression molding process for Fan-Out wafer level packaging
Bertheau, Julien; Duval, Fabrice; Kubota, Tadashi; Bex, Pieter; Kennes, Koen; Phommahaxay, Alain; Podpod, Arnita; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems
Phommahaxay, Alain; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Slabbekoorn, John; Inoue, Fumihiro; Peng, Lan; Kennes, Koen; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2019) -
Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer
Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Bauder, Olga; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Liu, Xiao; Schmidt, Thomas; Beyer, Gerald; Beyne, Eric (2020) -
Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
Derakhshandeh, Jaber; Beyne, Eric; Beyer, Gerald; Capuz, Giovanni; Cherman, Vladimir; De Preter, Inge; Gerets, Carine; Shafahian, Ehsan; Kennes, Koen; Jamieson, Geraldine; Cochet, Tom; Webers, Tomas; Tobback, Bert; Van der Plas, Geert; La Tulipe, Douglas Charles; Phommahaxay, Alain; Miller, Andy (2022) -
Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift
Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Kennes, Koen; Bertheau, Julien; Arumugam, Hariharan; Cochet, Tom; Rebibis, Kenneth June; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Overview of scalable transfer approaches to enable epitaxial 2D material integration
Brems, Steven; Ghosh, Souvik; Smets, Quentin; Boulon, Marie-Emmanuelle; Boelen, Andries; Kennes, Koen; Tsai, Hung-Chieh; Chancerel, Francois; Merckling, Clement; Wyndaele, Pieter-Jan; de Marneffe, Jean-Francois; Schram, Tom; Kumar, Pawan; Sergeant, Stefanie; Nuytten, Thomas; De Gendt, Stefan; Medina Silva, Henry; Groven, Benjamin; Morin, Pierre; Kar, Gouri Sankar; Lockhart de la Rosa, Cesar Javier; Yudistira, Didit; Van Campenhout, Joris; Asselberghs, Inge; Phommahaxay, Alain (2023) -
Process challenges during CVD oxide deposition on the backside of 20-μm thin 300-mm wafers temporarily bonded to glass carriers.
Kennes, Koen; Guerrero, Alice; Salahouelhadj, Abdellah; Suhard, Samuel; Derakhshandeh, Jaber; Phommahaxay, Alain; Brems, Steven; Beyer, Gerald; Beyne, Eric (2023) -
The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Phommahaxay, Alain; Guerrero, Alice; Kennes, Koen; Podpod, Arnita; Brems, Steven; Slabbekoorn, John; Tussing, Sebastian; Spiess, Walter; Penger, Luke; Yess, Kim; Arnold, Kim; Rapps, Thomas; Lutter, Stefan; Sleeckx, Erik; Huyghebaert, Cedric; Asselberghs, Inge; Miller, Andy; Beyer, Gerald; Radu, Iuliana; Beyne, Eric (2019) -
Wafer-scale Ge epitaxial foils grown at high growth rates and released from porous substrates for triple-junction solar cells
Depauw, Valerie; Porret, Clément; Moelants, Myriam; Vecchio, Emma; Kennes, Koen; Han, Han; Loo, Roger; Cho, Jinyoun; Courtois, Guillaume; Kurstjens, Rufi; Dessein, Kristof; Orejuela, Victor; Sanchez-Perez, Clara; Rey-Stolle, Ignacio; Garcia, Ivan (2023) -
Wafer-scale integration of double gated WS2-transistors in 300mm Si CMOS fab
Asselberghs, Inge; Smets, Quentin; Schram, Tom; Groven, Benjamin; Verreck, Devin; Afzalian, Aryan; Arutchelvan, Goutham; Gaur, Abhinav; Cott, Daire; Maurice, Thibaut; Brems, Steven; Kennes, Koen; Phommahaxay, Alain; Dupuy, Emmanuel; Radisic, Dunja; de Marneffe, Jean-Francois; Thiam, Arame; Li, Waikin; Devriendt, Katia; Huyghebaert, Cedric; Lin, Dennis; Caymax, Matty; Morin, Pierre; Radu, Iuliana (2020)