Wafer-scale integration of double gated WS2-transistors in 300mm Si CMOS fab

Abstract

Double gated WS2 transistors with gate length down to 18 nm are fabricated in a 300mm Si CMOS fab. By using large statistical data sets and mapping uniformity on full 300mm wafer, we built an integration vehicle where impact of each process step can be understood and developed accordingly to enhance device performance. In-depth analysis of V-T variability reveals multiple possible sources at different length scales, with the most prominent one being the channel material. The work presented here paves the way towards industrial adoption of 2D materials.